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IB048Q096T64N1-00
APPLICATIONS NOTE
pins should be bypassed with an RC damper (e.g., 47 μ F in series with
Parallel Operation
The IBC will inherently current share when operated in an array. Arrays may
be used for higher power or redundancy in an application. Current sharing
accuracy is maximized when the source and load impedance presented to
each IBC within an array are equal. The recommended method to achieve
matched impedances is to dedicate common copper planes within the PCB
to deliver and return the current to the array, rather than rely upon traces
of varying lengths. In typical applications the current being delivered to the
load is larger than that sourced from the input, allowing narrower traces to
be utilized on the input side if necessary. The use of dedicated power
planes is, however, preferable.
One or more IBCs in an array may be disabled without adversely affecting
operation or reliability as long as the load does not exceed the rated power
of the enabled IBCs.
The IBC power train and control architecture allow bi-directional power
transfer, including reverse power processing from the IBC output to its
input. The IBC’s ability to process power in reverse improves the IBC tran-
sient response to an output load dump.
Thermal Considerations
The temperature distribution of the VI Brick can vary significantly
with its input /output operating conditions, thermal management and
environmental conditions. Although the PCB is UL rated to 130°C, it is
recommended that PCB temperatures be maintained at or below 125°C.
For maximum long term reliability, lower PCB temperatures are
recommended for continuous operation, however, short periods of
operation at 125°C will not negatively impact performance or reliability.
WARNING: Thermal and voltage hazards. The IBC can operate with surface
temperatures and operating voltages that may be hazardous to personnel.
Ensure that adequate protection is in place to avoid inadvertent contact.
PART NUMBERING
Input Impedance Recommendations
To take full advantage of the IBC capabilities, the impedance presented to
its input terminals must be low from DC to approximately 5 MHz.
The source should exhibit low inductance and should have a critically
damped response. If the interconnect inductance is excessive, the IBC input
0.3 ) to retain of the IBC, the source and generally theGiven the
wide Ω bandwidth low source impedance response is operation. limiting
factor in the overall system response.
Anomalies in the response of the source will appear at the output of the
IBC multiplied by its K factor. The DC resistance of the source should be
kept as low as possible to minimize voltage deviations. This is especially
important if the IBC is operated near low or high line as the
overvoltage /undervoltage detection circuitry could be activated.
Input Fuse Recommendations
The IBC is not internally fused in order to provide flexibility in configuring
power systems. However, input line fusing of VI Bricks must always be
incorporated within the power system. A fast acting fuse should be placed
in series with the +In port. See safety agency approvals.
Application Notes
For IBC and VI Brick application notes on soldering, thermal management,
board layout, and system design visit vicorpower.com .
Product
Family
IB
Input
Voltage
048
Package
Q
Nominal
Output Voltage
096
Temperature
Grade
T
Output
Current
64
Enable
Logic
N = Negative
Pin
Length
1 = 0.145
Options
-00 = Open frame
P = Positive
2 = 0.210
-BP = Baseplate*
3 = 0.180
*For baseplate option please contact the factory for availability.
IBC MODULE
Page 11 of 15
Rev 1.9
5/2013
vicorpower.com
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